Method of manufacturing electronic device

ABSTRACT

An electronic device comprises a housing made of a polycarbonate resin, and a novel double-sided printed circuit board. The printed circuit board has one side embedded in the housing, and the other side exposed to the interior of the housing. A plurality of refractory electronic components are mounted onto one side of the printed circuit board and include a resistor and a capacitor. A plurality of lower refractory electronic components are mounted onto the other side of the housing and include a semiconductor integrated circuit, and a transformer. Preferably, an insulating layer is applied to cover the one side of the printed circuit board and the refractory electronic components. Also, a metal layer is applied to cover the insulating layer and the inner surface of the housing.

BACKGROUND OF THE INVENTION

1. Field of the Invention

The present invention relates to an electronic device wherein a housingand a printed circuit board are integrally formed together, and a methodof manufacturing the same.

2. Description of the Related Art

A conventional electronic device includes a housing made of syntheticresin, and a flexible printed circuit board integrally mounted in thehousing, as disclosed in Japanese Laid-Open Patent Publication No.63/80597. The printed circuit board has one side embedded in the housingand the other side exposed to the interior of the housing. An aluminumfoil is placed between the one side of the printed circuit board and thehousing. A plurality of electronic components are mounted onto the otherside of the housing, only. In the prior art device, substantial space isrequired for a large number of electronic components. In such a case,the size of the device increases.

SUMMARY OF THE INVENTION

Accordingly, it is an object of the present invention to provide anelectronic device and a method of manufacturing same, which allowsmounting of a greater number of electronic components than the prior artdevice without bringing about an increase in size, and which is highlyreliable in operation.

According to one aspect of the present invention, there is provided anelectronic device comprising a housing made of synthetic resin, aprinted circuit board having one side embedded in the housing, and theother side exposed to the interior of the housing, wherein a pluralityof refractory electronic components are mounted onto the one side of theprinted circuit board, and a plurality of lower refractory electroniccomponents are mounted onto the other side of the printed circuit board.The electronic device of the present invention provides a noveldouble-sided printed circuit board to allow mounting of more electroniccomponents than in a presently available single-sided printed circuitboard without increasing its size.

Preferably, an insulating layer is applied to cover the one side of theprinted circuit board and the refractory electronic components. Theinsulating layer may be made of the same resin as the housing, forexample, a polycarbonate resin. Also, a metal layer is applied to coverthe insulating layer and the inner surface of the housing so as toprovide an electromagnetic shield.

According to another aspect of the present invention, there is provideda method of manufacturing an electronic device, comprising the steps ofmounting a plurality of refractory electronic components onto one sideof a printed circuit board, attaching the printed circuit board to amale mold so as to face the one side of the printed circuit boardagainst a female mold, cooperating with the male mold and the femalemold to define a cavity therebetween, introducing a resin into thecavity to mold a housing such that the one side of the printed circuitboard is embedded in the housing, and the other side of the printedcircuit board is exposed to the interior of the housing, and mounting aplurality of lower refractory electronic components onto the other sideof the printed circuit board.

According to a further aspect of the present invention, there isprovided a method of manufacturing an electronic device, comprising thesteps of mounting a plurality of refractory electronic components ontoone side of a printed circuit board, attaching the printed circuit boardto a male mold so as to face the one side of the printed circuit boardagainst a female mold, applying an insulating layer to cover the oneside of the printed circuit board and the refractory electroniccomponents, applying a metal layer to cover the insulating layer and atleast part of the male mold, cooperating with the male mold and thefemale mold to define a cavity therebetween, introducing a resin intothe cavity to mold a housing such that the one side of the printedcircuit board is embedded in the housing, and the other side of theprinted circuit board is exposed to the interior of the housing, andmounting a plurality of lower refractory electronic components onto theother side of the printed circuit board.

The refractory electronic components are soldered to the one side of theprinted circuit board. A solder material preferably includes an alloy oflead and silver when the housing is made of a polycarbonate resin. Theinsulating layer and at least part of the male mold are firstelectrolessly plated with copper or aluminum, and then, electrolyticallyplated with the same metal to form a metal layer on the insulatinglayer. Alternatively, copper or aluminum may be vapor deposited on theinsulating layer and at least part of the male mold. Also, a copper oraluminum foil may be provided on the insulating layer and at least partof the male mold.

These and other objects, and advantages of the present invention will beapparent from the following detailed description of preferredembodiments when taken in conjunction with the accompanying drawings.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 is a sectional view of an electronic device made according to oneembodiment of the present invention;

FIG. 2 is a sectional view showing the manner in which the electronicdevice shown in FIG. 1 is manufactured;

FIG. 3 is a sectional view of an electronic device made according toanother embodiment of the present invention; and

FIG. 4 is a sectional view showing the manner in which the electronicdevice shown in FIG. 3 is manufactured.

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

FIG. 2 illustrates a method of manufacturing the electronic device ofFIG. 1. Specifically, the resistor 14, the capacitor 16 and otherrefractory components are first soldered to the one side 12a of theprinted circuit board 12. The solder should stand a temperature at whicha resin used to mold the housing may flow and is, preferably, an alloyof lead and silver (2 to 4 percent by weight) when a polycarbonateresin, which flows at a temperature of 300° C., is used. Also, when aresin having a higher melting point than a polycarbonate resin may flowis used, an alloy of gold and silicon (5 to 7 percent by weight) orgermanium (10 to 15 percent by weight) is preferred. The printed circuitboard 12 is then temporarily attached to the bottom of a male mold 22,for example, by an adhesive so as to face the one side 12a of theprinted circuit board 12 against a female mold 24. The male mold 22 andthe female mold 24 cooperate together to define a cavity 26therebetween. A polycarbonate resin is introduced through a gate 28 intothe cavity 26 to mold the housing 10 such that the one end 12a of theprinted circuit board 12 is embedded in the housing 10, and the otherside 12b of the printed circuit board 12 is exposed to the interior ofthe housing 10. Finally, the semiconductor integrated circuit 18, thetransformer 20 and other lower refractory components are mounted ontothe other side 12b of the printed circuit board 12 by resistance weldingor similar means.

FIG. 3 shows a modified form of the electronic device shown in FIG. 1.In the illustrated embodiment, the electronic device generally includesa housing 30 made of resin, and a printed circuit board 22 mounted inthe housing 30. The printed circuit board 32 has one side 32a embeddedin the housing 30, and the other side 32b exposed to the interior of thehousing 30. A resistor 34, a capacitor 36 and other refractoryelectronic components or chips are mounted onto the one side 32a of theprinted circuit board 32. A semiconductor integrated circuit 38, atransformer 40 and other lower refractory electronic components aremounted onto the other side 32b of the printed circuit board 32. Aninsulating layer 42 is applied to cover the one side 32a of the printedcircuit board 32 and the resistor 34, the capacitor 36 and otherrefractory electronic components. In addition, a metal layer 44 isapplied to cover the inner surface 30 of the housing 30 and theinsulating layer 42.

Referring to FIG. 4, the resistor 34, the capacitor 36 and otherrefractory components are first soldered to the one side 32a of theprinted circuit board 32. The solder should stand a temperature at whicha resin may flow and is, preferably, an alloy of lead and silver (2 to 4percent by weight) when a polycarbonate resin, which may flow at atemperature of approximately 300° C., is used. Also, when a resin havinga higher melting point than a polycarbonate resin may flow is used, analloy of gold and silicon (5 to 7 percent by weight) or germanium (10 to15 percent by weight) is preferred. The insulating layer 42 ispreferably made of a polycarbonate resin and applied to cover theresistor 34, the capacitor 36 and other refractory electroniccomponents. The male mold 50 includes a base 50a, and a rectangularprojection 50b extending from one side of the base 50a. The insulatinglayer 42 and the projection 50b are first electrolessly plated withcopper or aluminum. The electroless plating has a thickness ofapproximately 0.5 to 1 μm. The insulating layer 42 and the projection50b are then electrolytically plated with the same metal. Theelectrolytic plating has a thickness of approximately 10 to 30 μm. Theelectroless plating and the electrolytic plating together form the metallayer 44. As an alternative, the metal layer may be made by spraying orvapor deposition. A copper or aluminum foil having a thickness ofapproximately 10 to 30 μm may also be used to form the metal layer. Thefemale mold 52 has a gate or opening 54 and cooperates with the malemold 50 to define a cavity 56 therebetween. A polycarbonate resin isintroduced through the gate 54 into the cavity 56 to mold the housing 30such that the one end 32a of the printed circuit board 32 is embedded inthe housing 30, and the other side 32b of the printed circuit board 32is exposed to the interior of the housing 30. Finally, the semiconductorintegrated circuit 38, the transformer 40 and other lower refractorycomponents are mounted onto the other side 32b of the printed circuitboard 32 by resistance welding or similar means.

While the methods and devices manufactured by the methods hereindisclosed form preferred embodiments of the invention, it is not limitedto those specific methods and devices, and various changes andmodifications may be made therein without departing from the spirit andscope of the invention.

What is claimed is:
 1. A method of manufacturing an electronic device,comprising the steps of:mounting a plurality of refractory electroniccomponents onto one side of a printed circuit board; attaching saidprinted circuit board temporarily to a male mold so as to face said oneside of the printed circuit board against a female mold; cooperatingwith said male mold and said female mold to define a cavitytherebetween; introducing a resin into said cavity to mold a housingsuch that said one side of the printed circuit board is embedded in saidhousing, and the other side of the printed circuit board is exposed toan interior of said housing; and mounting a plurality of lowerrefractory electronic components onto the other side of said printedcircuit board.
 2. The method of claim 1, wherein said resin is apolycarbonate resin, and said plurality of refractory electroniccomponents are soldered to said one side of said printed circuit boardby a solder material, said solder material including an alloy of leadand silver.
 3. The method of claim 1, wherein said resin has a highermelting point than a polycarbonate resin, and said plurality ofrefractory electronic components are soldered to said one side of saidprinted circuit board by a solder material, said solder materialincluding an alloy of gold and silicon.
 4. The method of claim 1,wherein said resin has a higher melting point than a polycarbonateresin, and said plurality of refractory electronic components aresoldered to said one side of said printed circuit board by a soldermaterial, said solder material including an alloy of gold and germanium.5. The method of claim 1, wherein said plurality of lower refractoryelectronic components are mounted to the other side of said printedcircuit board by resistance welding.
 6. A method of manufacturing anelectronic device, comprising the steps of:mounting a plurality ofrefractory electronic components onto one side of a printed circuitboard; attaching said printed circuit board temporarily to a male moldso as to face said one side of the printed circuit board against afemale mold; applying an insulating layer to cover said one side of thecircuit board and said refractory electronic components; applying ametal layer to cover said insulating layer and at least part of saidmale mold; cooperating with said male mold and said female mold todefine a cavity therebetween; introducing a resin into said cavity tomold a housing such that said one side of the printed circuit board isembedded in said housing, and the other side of the printed circuitboard is exposed to an interior of said housing; and mounting aplurality of lower refractory electronic components onto the other sideof said printed circuit board.
 7. The method of claim 6, wherein saidresin is a polycarbonate resin, and said plurality of refractoryelectronic components are soldered to said one side of said printedcircuit board by a solder material, said solder material including analloy of lead and silver.
 8. The method of claim 6, wherein saidinsulating layer and said at least part of the male mold are firstelectrolessly plated with a metal, and then, electrolytically platedwith a same metal.
 9. The method of claim 6, wherein a metal is vapordeposited on said insulating layer and said at least part of the malemold.
 10. The method of claim 6, wherein a copper foil is placed on saidinsulating layer and said at least part of the male mold.
 11. The methodof claim 6, wherein an aluminum foil is placed on said insulating layerand said at least part of the male mold.